发明名称 Resin bonded moulding mixtures
摘要 <p>Fragments of granular or sheet plastic are used with rough fragments of material such as wood chips, expanded mica or paper and by the simultaneous application of heat and of small amounts (0.2 - 2%) of a relatively high boiling solvent the mass is caked or sintered together so that the mixture can be moulded at or below the melting point of the plastic.</p>
申请公布号 DE2010575(A1) 申请公布日期 1971.09.16
申请号 DE19702010575 申请日期 1970.03.06
申请人 HESSEN H 发明人
分类号 B29B17/00;C08J3/20;C08J11/06;C08L23/06;C08L27/06;C08L97/02;(IPC1-7):29B3/00 主分类号 B29B17/00
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