| 摘要 |
<p>PURPOSE:To prevent solder plating from adhering to a lead forming die by a method wherein a pipe through which die cooling fluid is made to flow is provided inside the lead forming die. CONSTITUTION:A die cooling pipe 2 is provided inside a lower die 1, and cooling fluid is made to flow through the pipe 2 as supplied from the outside. Therefore, the lower die 1 is cooled down always. Then, even if an upper die 3 is in operation to carry out a lead 7 forming process, solder plating is prevented from adhering to a punch 4 or a die 5.</p> |
