| 摘要 |
<p>PURPOSE:To eliminate a blister of a magnetic shield layer by forming a gas transmission part on a magnetic shield layer for shielding a part between layers of a multilayer printed-circuit board magnetically. CONSTITUTION:A wiring circuit is formed on one copper foil-clad surface of a double-sides copper-clad polyimide film 5 by the normal subtractive method and round holes 28 are provided at six locations of a copper foil on the other surface. The copper foil where the round holes 28 are formed becomes a magnetic shield layer 10. Also, a magnetic shield layer 18 of a second layer 3 uses a double-sided copper-clad polyimide film 16, a wiring circuit is formed on one copper foil surface, and the round holes 28 are formed on the other copper foil surface. A copper foil where the round holes 28 are formed becomes a magnetic shield layer 18. Also, a thickness 10-125mum is used as a polyimide film and a copper foil with a thickness of 5-70mum is used as a conductor and a magnetic shield sheet, and acryl, epoxy rubber, and polyimide adhesives with a thickness of 5-100mum and used as adhesives.</p> |
