| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a TAB tape carrier which is capable of protecting damage to a conductive portion after the conductive portion is formed. SOLUTION: After small holes 5 are formed on a base film 3 on which a protection film 4 is deposited on one surface of the base film 3, plating, etc., is carried out from its one surface side, conductive portions 7 of thickness which does not exceed the surface 4a of the protective film are formed in the small holes 5. The protection film 4 is broken away after an electronic component is loaded on the base film 3.
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