发明名称 RESIN FOR PHOTORESIST COMPOSITION, PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin for a photoresist composition good in resolution and characteristics of line edge roughness, a photoresist composition using the resin and a method for forming a resist pattern. <P>SOLUTION: The resin for the photoresist composition has a hydroxy group bonding to a carbon atom at a polymer end, where a carbon atom at the &alpha;-position of the hydroxy group has at least one electron withdrawing group. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005206775(A) 申请公布日期 2005.08.04
申请号 JP20040057449 申请日期 2004.03.02
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HANEDA HIDEO;TAKESHITA MASARU;MATSUMARU SHOGO;SHIMIZU HIROAKI
分类号 G03F7/033;C08F2/38;C08F220/28;G03F7/004;G03F7/039;H01L21/027;H01L21/30 主分类号 G03F7/033
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