发明名称 |
RESIN FOR PHOTORESIST COMPOSITION, PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin for a photoresist composition good in resolution and characteristics of line edge roughness, a photoresist composition using the resin and a method for forming a resist pattern. <P>SOLUTION: The resin for the photoresist composition has a hydroxy group bonding to a carbon atom at a polymer end, where a carbon atom at the α-position of the hydroxy group has at least one electron withdrawing group. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005206775(A) |
申请公布日期 |
2005.08.04 |
申请号 |
JP20040057449 |
申请日期 |
2004.03.02 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
HANEDA HIDEO;TAKESHITA MASARU;MATSUMARU SHOGO;SHIMIZU HIROAKI |
分类号 |
G03F7/033;C08F2/38;C08F220/28;G03F7/004;G03F7/039;H01L21/027;H01L21/30 |
主分类号 |
G03F7/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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