| 摘要 |
A strip-shaped adhesive tape is joined to a ring frame, and then is stuck with a cutter blade having a flat plane obtained by forming a cutting edge into a wedge shape such that the cutter blade penetrates through the adhesive tape. In this state, the cutter blade cuts the adhesive tape along a contour of the ring frame while the flat plane is brought into contact with a tape joined side of the ring frame. Thereafter, an unnecessary portion of the adhesive tape is removed from the ring frame. A wafer is placed on a center of the ring frame to which the adhesive tape is joined. A joining roller joins the adhesive tape to a back face of the wafer.
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