发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system and method capable of guaranteeing quality of a substrate which has been subjected to repair work and is input into an electronic component mounting line. <P>SOLUTION: In this electronic component mounting system and method for manufacture a mounted substrate through the electronic component mounting line 1 formed by connecting a plurality of devices in series, as for the substrate determined to be repaired by inspection devices M2, M5, M7, taken out from the electronic component mounting line 1 to carry out failure repairing work, and input again to the electronic component mounting line, a host device 3 determines whether or not the substrate has been inspected again by an inspection device corresponding to the failure repairing work based on its inspection history, and whether or not the substrate is allowed to be carried to the downstream is decided. Thereby, quality of the substrate which has been repaired can be guaranteed by making sure that an inspection corresponding to the work content of the failure repairing work is carried out again. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009021467(A) 申请公布日期 2009.01.29
申请号 JP20070183971 申请日期 2007.07.13
申请人 PANASONIC CORP 发明人 KAITA KENICHI;NAGAYA TOSHIHIKO;SAKURAI KOJI
分类号 H05K13/00;H05K3/34;H05K13/08 主分类号 H05K13/00
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