发明名称 Ultra-high density storage device using phase change diode memory cells and methods of fabrication thereof
摘要 An ultra-high density data storage device using phase-change diode memory cells, and having a plurality of emitters for directing beams of directed energy, a layer for forming multiple data storage cells and a layered diode structure for detecting a memory or data state of the storage cells, wherein the device comprises a phase-change data storage layer capable of changing states in response to the beams from the emitters, and a second layer forming one layer in the layered diode structure, the second layer comprising a material containing copper, indium and selenium. A method of forming a diode structure for a phase-change data storage array, having multiple thin film layers adapted to form a plurality of data storage cell diodes, comprises depositing a first diode layer of CuInSe material on a substrate and depositing a second diode layer of phase-change material on the first diode layer.
申请公布号 US2005048733(A1) 申请公布日期 2005.03.03
申请号 US20030654189 申请日期 2003.09.03
申请人 ASHTON GARY R.;GIBSON GARY A.;BICKNELL-TASSIUS ROBERT N. 发明人 ASHTON GARY R.;GIBSON GARY A.;BICKNELL-TASSIUS ROBERT N.
分类号 G03F7/20;G11B9/00;G11B9/04;G11B9/10;G11B11/00;G11B11/08;(IPC1-7):H01L21/20 主分类号 G03F7/20
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