| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent generation of burrs in a package with a constitution of exposing a die pad.SOLUTION: A semiconductor device comprises: a die pad on which a semiconductor element 12 is mounted and which has a thin part 21 which is located on an outer peripheral part of the die pad and which is thinner than the other portion and elastically accessible to a die surface (top face) of a lower die 20 of a molding die 18 on which an undersurface of the die pad is placed. The die pad has a pressure force generation part 22 which is provided on a top face side of the die pad and closer to an outer periphery of the die pad, for generating a pressing force for pressing the thin part 21 to the die surface of the lower die 20 by pressure of a molten resin R flowing from the gate 19a at the time of resin molding.SELECTED DRAWING: Figure 3 |
