| 摘要 |
PURPOSE:To provide a jet type solder tank which sticks thoroughly solder to the chip parts, etc. mounted densely on a printed circuit board by providing means for moving the many rugged waves formed on the peak surface of the jet liquid of the solder melts ejected from the ejection ports of jet tanks in the direction intersecting the traveling direction of the printed circuit board. CONSTITUTION:The solder melts 6, 7 in a primary tank 4 and a secondary tank 5 are pressurized by rotating impellers 10, 11 and are fed into jet tanks 8, 9. The melt 6 entering the tank 8 is run in an arrow direction A through the screw part 21 of a rotating body 20 and is ejected 18 thereby forming many rugged waves 6b in the direction intersecting the traveling direction D of a printed circuit board 1. On the other hand, the body 20 rotates in an arrow B direction and therefore the screw part 21 moves apparently in the direction C. The side face 22a of the projecting part 22 of the melt 6 moves consequently and apparently in the arrow C direction when the melt 6 passes the recessing part 23 in the arrow A direction and therefore the rugged waves 5b on the peak surface of the jet wave 5a moves in the arrow C direction as well. When the body 20 rotates in the opposite direction, the rugged waves 6b on the peak surface move in the direction opposite from the arrow C direction and the above-mentioned movement is alternately repeated, whereby the melt is stuck of the board 1. |
