| 摘要 |
<p>PURPOSE:To mount/dismount a microcomputor freely by mounting only the microcomputor on a wiring board, accommodating the wiring board in a space defined by a hole made at a desired position of one of two substrates, and arranging a plurality of circuit elements on the other substrate superposed by the wiring board. CONSTITUTION:Power circuit elements 4 producing heat are mainly mounted on a substrate 2B superposed by a wiring board 8, and a plurality of circuit elements 4 such as chip capacitors are mounted on the entire area of substrates 2A, 2B. The plurality of circuit elements and electronic parts 13 mounted on the substrates 2A, 2B are hermetically encapsulated in a space 14 defined by a casing member 6 and the substrates 2A, 2B, and only the wiring board 8 mounting a microcomputor 7 is sealed hermetically by the casing member 6 and a cover body 17. The wiring board 8 mounting the microcomputor 7 is disposed and accommodated in a space defined by a hole 5 made at a desired position of one substrate 2A and connected with conducting paths 3 formed on the other substrate 2A. By such arrangement, the microcomputor 7 can be mounted/dismounted freely.</p> |
