CHUCK APPARATUS FOR CLAMPING A PLANAR SUBSTRATE IN AN ELECTROSTATIC COATING METHOD

摘要

The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising:a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; andb. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.