发明名称 PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To attempt to make thinner a printed-wiring board as well as simplifying its manufacturing method, the printed-wiring board that has electronic elements built in and has a shield structure for shielding radiation noises arising from the electronic elements and the board's wiring pattern. <P>SOLUTION: Two boards 1a and 1b with electronic elements 3a and 3b mounted thereon are faced with their surfaces opposed where the electronic elements 3a and 3b are mounted, insulating adhesive sheets 5a and 5b having a copper foil or an electromagnetic shield sheet 6 in between are inserted and heat-crimped between the upper and lower boards 1a and 1b, and the copper foil or the electromagnetic shield sheet 6 is laid along the irregularities of the electronic elements 3a and 3b mounted on the boards 1a, 1b. Then, a through-hole 7 is formed at a part in which a ground pattern 4 of the upper and lower boards 1a and 1b is formed, to connect the copper foil or the electromagnetic shield sheet 6 and the ground pattern 4 of the boards 1a and 1b. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006344887(A) 申请公布日期 2006.12.21
申请号 JP20050170996 申请日期 2005.06.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISOBE YOSHIAKI;ARAI HIDEAKI;SATO SADAO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
主权项
地址