发明名称 THERMOPLASTIC MOLDING COMPOUNDS
摘要 The invention relates to thermoplastic molding compounds that contain (Co) polymers and graft polymers and 0.1 to 8 wt.-% of a combination of at least 3 components selected from the compounds (I), (II), (III) and (IV). (I) is a compound with at least one structural unit (a) wherein M = metal and n = valency of the metal M. Compound (II) is a compound with at least one structural unit (b) and compound (III) is a compound with at least one structural unit (c). Compound (IV) represents a compound that contains none of the structural units comprised by compounds (I) to (III).
申请公布号 CA2376451(C) 申请公布日期 2008.04.29
申请号 CA20002376451 申请日期 2000.05.30
申请人 BAYER AKTIENGESELLSCHAFT 发明人 EICHENAUER, HERBERT;LEITZ, EDGAR
分类号 C08J5/00;C08L55/02;C08K5/01;C08K5/09;C08K5/098;C08K5/10;C08K5/101;C08K5/103;C08K5/20;C08L25/02;C08L25/12;C08L25/16;C08L33/12;C08L33/20;C08L35/00;C08L39/04;C08L51/04;C08L91/00 主分类号 C08J5/00
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