发明名称 |
THERMOPLASTIC MOLDING COMPOUNDS |
摘要 |
The invention relates to thermoplastic molding compounds that contain (Co) polymers and graft polymers and 0.1 to 8 wt.-% of a combination of at least 3 components selected from the compounds (I), (II), (III) and (IV). (I) is a compound with at least one structural unit (a) wherein M = metal and n = valency of the metal M. Compound (II) is a compound with at least one structural unit (b) and compound (III) is a compound with at least one structural unit (c). Compound (IV) represents a compound that contains none of the structural units comprised by compounds (I) to (III).
|
申请公布号 |
CA2376451(C) |
申请公布日期 |
2008.04.29 |
申请号 |
CA20002376451 |
申请日期 |
2000.05.30 |
申请人 |
BAYER AKTIENGESELLSCHAFT |
发明人 |
EICHENAUER, HERBERT;LEITZ, EDGAR |
分类号 |
C08J5/00;C08L55/02;C08K5/01;C08K5/09;C08K5/098;C08K5/10;C08K5/101;C08K5/103;C08K5/20;C08L25/02;C08L25/12;C08L25/16;C08L33/12;C08L33/20;C08L35/00;C08L39/04;C08L51/04;C08L91/00 |
主分类号 |
C08J5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|