METHOD OF PACKAGING WAFER LEVEL DEVICE PACKAGE

摘要

The wafer level device packaging method is provided to prevent the generation of warpage in the thermal process and to reduce the stress about the wafer for device substrate and the wafer for the cap substrate. The wafer(10) for the cap substrate is mounted on the wafer supporter (Wafer Support Substrate)(20) by the medium of the adhesive(12). The separate space(13) is formed for setting up the cutting line(50) and for surrounding a plurality of vias(11). The upper seal ring pattern(14) is formed with the closed line. The wafer supporter and the wafer are bonded by adhesive. The warpage by the thermal expansion can be prevented by the separate space.