A SUBSTRATE STRIP AND A METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES BY USING THE SAME

摘要

A substrate strip and a method for manufacturing a semiconductor package by using the same are provided. The substrate strip comprises: a substrate including a plurality of unit regions and a dummy region surrounding the plurality of unit regions; internal wirings and ground terminals arranged in each of the unit regions of the substrate; a dummy structure arranged in the dummy region of the substrate; first conductive lines configured to connect the ground terminals, arranged in the unit regions adjacent to the dummy region, to the dummy structure; and second conductive lines configured to connect the ground terminals of the unit regions which are adjacent to each other. Therefore, the substrate strip can protect semiconductor chips from an instantaneous electrostatic discharge or an instantaneous high current surge which are inputted from the outside during processes of packaging the semiconductor chips.