发明名称 BALL FORMING DEVICE FOR WIRE BONDER
摘要 PURPOSE:To provide a ball formation device for wire bonder having high responding speed even when spark discharge is unstable, and capable of maintaining a stabilized supply of constant current at all time and forming the optimum ball diameter. CONSTITUTION:The formation of a loop which comprises a drive power supply circuit 11 connected with a power supply circuit 1 and a current control circuit 12 and a switch circuit 5 connected with the drive power supply circuit 11 makes it possible to inhibit the generation of phase lag, and form a constant ball diameter by supplying stabilized constant current between a wire 8 and a discharge electrode 10.
申请公布号 JPH0521500(A) 申请公布日期 1993.01.29
申请号 JP19910194982 申请日期 1991.07.10
申请人 URA MASANAO 发明人 URA MASANAO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址