| 摘要 |
1,164,670. Magnetic structures. INTERNATIONAL BUSINESS MACHINES CORP. 4 Dec., 1967 [15 Dec., 1966], No. 55020/67. Heading H1H. [Also in Division C7] A magnetic alloy film is formed on a conductive substrate by electroplating from an electrolyte containing ions of the alloy constituents by applying one or more current pulses in which the magnitude of the or each pulse is initially significantly greater than the current required for plating the alloy constituents in a desired proportion under equilibrium conditions and in which the magnitude of the pulse is subsequently decreased with time so that throughout the process the proportions of the alloy constituents deposited are constant. Typically the pulse magnitude is decreased to the equilibrium value and is thereafter maintained constant for a period. If a series of pulses is used, agitation of the electrolyte may be effected at the end of each pulse. As described the method is applied to electroplating on to a smooth rolled copper sheet or vapour deposited silver or electroless silver or copper a Ni/Fe alloy. Details are given of current values for obtaining specific thicknesses of specific alloys. Plating is effected in a magnetic field at the centre of a Helmholtz coil. Reference is made to plating ternary alloys NiFeCu, e.g. as in Specification 1,139,987, NiFeCo and a four component alloy NiFeCoCu, all of zero magnetostriction. |
