| 摘要 |
PURPOSE:To obtain an inexpensive device for small size by face-down bonding an IC chip on a circuit board, and screen printing thermosetting resin from the back surface, thereby sealing the chip. CONSTITUTION:An IC chip 2 is face-down bonded to the circuit pattern 1a of a board 1 with a bump 3. The hole 4a of a mask 4 is set above the chip 2, and resin 5 is screen printed. Then, the chip 2 can be completely sealed with the minimum space. According to this configuration, the board side may be formed in the thickness of thin resin, it is adapted for printing, and the chip can be sealed in small size inexpensively. |
