| 摘要 |
PURPOSE:To obtain a flame-retardant thermosetting resin composition excellent in storage stability, heat resistance, and moldability by incorporating a specific epoxy compound into a thermosetting resin. CONSTITUTION:The resin composition comprises preferably 100 pts.wt. thermosetting resin (e.g. a phenolic resin) and an epoxy compound, preferably 2-50 pts.wt. epoxy compound represented by formula I [wherein A is -CH2-, -SO2-, -O-, or the group represented by formula II; R<1> is H or CH3; Y is Br, Cl, CH3, or H; X is Br or Cl; m and n each is 1-4; l is 1.0-3.0; and B is a group represented by one of formulae III to VI (where r and q each is 0-5 and R<2> to R<4> each is H, CH3, or CH2Y)]. |
