INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To realize high density mounting, while enhancing connection reliability. SOLUTION: An integrated circuit chip 5 has conductive bump 4 which project from one side thereof, while a circuit board 1 has recesses 2 for receiving the bump 4 made in one side of the integrated circuit chip 5 and a conductive resin 3 which filled the recess 2. The recess 2 has dimensions larger than those of the bump 4, and the conductive resin 3 is interposed between them.