| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board repairing method which can repair the parts being the object of repair favorably and certainly by automatically getting a proper repair temperature, and to provide a circuit board manufacturing method, and a repair device. SOLUTION: A BGA package 2 to be mounted is arranged in the specified position of a printed wiring board 1. The BGA package 2 is covered with a cover member 5, and nozzles 6, 6, 6, and 6 pierce the cover member 5. Temperature measuring means 9 and 9 are arranged on both sides of the cover member 5, and the measured temperature is outputted to a temperature controller 8. The temperature controller 8 changes the gas heating temperature of a heat source 7 so that it comes close to a stored standard heating pattern, and the temperatures of the hot blast jetted out of the nozzles 6, 6, 6, and 6 are feedback-controlled separately.
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