| 摘要 |
PROBLEM TO BE SOLVED: To provide a passive component by which a module is made small in size and whose cost is reduced, when configuring the module to be connected to a semiconductor component, etc. SOLUTION: This passive component comprises: a dielectric substrate 12 on which first and second unbalanced input/output terminals 44 and 52 are formed; a filter 14 formed in the dielectric substrate 12 and connected to the first unbalanced input/output terminal 44; and a matching circuit 16 formed in the dielectric substrate 12 and connected between the filter 14 and the second unbalanced input/output terminal 52. The matching circuit 16 comprises: a coil electrode 60 formed on a principal plane of an eighth dielectric layer S8 and constituting an inductance component; a first capacitor electrode 62 formed on a principal plane of a seventh dielectric layer S7 and constituting a capacitance component; and a second capacitor electrode 64 formed on a principal plane of a sixth dielectric layer S6 and constituting the capacitor component. COPYRIGHT: (C)2005,JPO&NCIPI
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