| 摘要 |
Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device during, for example, circuit debugging, assembly qualification, and the like. A first set of pads is configured in a predetermined pattern on the bottom surface of a flexible substrate. Similarly, a second set of pads is configured in substantially the same pattern on the top surface of the flexible substrate, wherein each of the pads in the second set of pads is electrically continuous with a corresponding pad in the first set of pads. A third set of pads is configured in the same pad pattern on the top surface of the flexible substrate. One or more conductive traces are formed to connect one or more pads in the first set of pads with spatially-corresponding pads in the third set of pads.
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