| 摘要 |
The present invention provides a wafer manufacturing apparatus which comprises: a chamber which reaction gas is introduced into and discharged from; a wafer boat provided inside the chamber, and supporting a plurality of wafers processed through the introduced reaction gas; and a reflecting plate individually provided in one end unit or both end units of the wafer boat to prevent pressure of introducing or discharging the reaction gas into or from the chamber from being directly exposed to the aligned wafer on the wafer boat. |
