Verfahren zum Aufbringen von Gold auf eine kupferkaschierte Polyaethylenterephthalat-Platte

摘要

1,233,169. Gold plating copper clad substrate. INTERNATIONAL BUSINESS MACHINES CORP. Nov.18, 1969 [Dec.31, 1968], No.56311/69. Heading C7B. A gold plated copper clad substrate for printed circuits is produced by bonding a Cu film to a polyethylene terephthalate substrate using a compatible (e.g. polyester) adhesive and electroplating a Au film on selected portions of the Cu film, e.g. the desired circuitry pattern formed by etching, using an Au plating bath having a pH or 5À9 to 7.