发明名称 METHOD AND DEVICE FOR POLISHING
摘要 <p>PURPOSE:To supply the processing liquid uniformly while thermal deformation of a holder is suppressed, by immersing a work to be processed and a polisher completely in a processing solution, and supplying the solution having passed through the polisher to the work from the opposed face side of the polisher. CONSTITUTION:A polishing device is chiefly composed of a work holding part 2 which holds a work to be processed 1 and rotates it, a polisher holding part 4 which presses polisher 3 to the work 1 and rotates the polisher in reversals by a swing driving part 13, and a processing solution supply part 6 to supply a processing solution 5 to the part of processing. The processing solution 5 is interposed between the work 1 and polisher 3 and they are moved in relative motions, and thereby polishing is performed in the condition being contacted. At this time, the work 1 and polisher 3 are immersed completely in the processing solution 5 contained in a processing trough 7. The solution 5 having passed through the polisher 3 is supplied to the work 1 from the opposed face side of the polisher 3 to the work 1.</p>
申请公布号 JPH05177535(A) 申请公布日期 1993.07.20
申请号 JP19920001891 申请日期 1992.01.09
申请人 TOSHIBA CORP 发明人 KOIKE EIJIRO
分类号 B24B37/00;B24B57/02 主分类号 B24B37/00
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