发明名称 COMPLEX DEVICE FOR BENDING AND LASER PROCESSING
摘要 PURPOSE:To automatically perform bending, cutting, and boring in a series of processes without changing the preparation by installing a laser processing head movable at least in the Y- and Z-directions and rotatable in the B-direction in front of a bending device. CONSTITUTION:A work W grasped by a manipulator 11 is cut by a laser processing machine into a plate form. Then the manipulator 11 is moved in the X-direction from the position for avoiding bending process to the bending position. When the work is located in the bending position, a bending process is made by a bending device 3. If in this manner bending is made at the four edges of the work W, a product for example box shaped is obtained. The butting part of each edge is welded with a laser processing head 99. Boring in each surface bent may be carried out either before or after the bending process by the laser processing head.
申请公布号 JPH05185338(A) 申请公布日期 1993.07.27
申请号 JP19920003753 申请日期 1992.01.13
申请人 AMADA CO LTD 发明人 MASUHIRO SHINJI
分类号 B21D5/04;B23K26/00;B23K26/38;B23P23/04 主分类号 B21D5/04
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