| 摘要 |
1,198,900. Semi-conductor devices. HITACHI Ltd. 23 Oct., 1968 [25 Oct., 1967; 18 Dec., 1967], No. 50280/68. Heading H1K. [Also in Division C7] A plurality of projecting lead conductors are integrally formed with the electrodes on the surface of a semi-conductor body through an insulating surface film, each projecting conductor 19 being a conductive whisker grown by means of a vapour-liquid-solid phase method of growth on the surface of the electrode 16 where it extends over the insulating film 14. The projecting conductors may be made of metal such as copper, iron or aluminium with a tip 18 of silver, or of semi-conductor such as silicon precipitated from monosilane heavily doped with boron or phosphorus with a tip of gold or platinum. The electrodes 16 are of high melting-point metal, such as molybdenum, chromium or tungsten. To improve the bond between the projecting lead and the electrode a thin layer (20) of gold may be evaporated on to the electrode surface prior to whisker growth, Fig. 7 (not shown). The projecting leads may be relatively short and form connecting supports for a device (10) or integrated circuit on a substrate (30), Fig. 8 (not shown), or they may be relatively long and connect a device or integrated circuit bonded on a stem (41) to lead wires (42, 43) by soldering, Fig. 10 (not shown). A description of the vapourliquid-solid phase method of whisker growth is given in the Specification. |
