| 摘要 |
PURPOSE:To prevent possible vain bonding and rejected products for a stable bonding detecting the connection between the bonding and the wire in a wire disconnection detecting mechanism of a wire bonding equipment by ultrasonic method. CONSTITUTION:A wire 14 is pressed against a bonding pad and an externally connected lead 3 of a package 1 set on a chip 2 with a wedge 15 directly connected to an ultrasonic hone 16 welded with a heat generated by ultrasonic vibration. The wire 14 is supplied from a wire spool 23 and reaches the wedge 15 via a wire clamper 17. The ultrasonic hone is connected to a power source 22 through an ammeter 21 while the other end of the power source is connected to the wire 14 on the wire spool 23. The wire spool, the wire, the wedge, the ultrasonic hone and the power source form an electrically closed circuit. Upon the disconnection of the wire, the circuit is cut off, thereby direct detection of the wire disconnection and preventing possible vain bonding. |
