| 摘要 |
PURPOSE:To form a diffusion layer of nickel-copper between a plating layer and copper base metal and improve heat conduction and durability by plating nickel on the inside surface of a copper made mold and heating the same for a required time. CONSTITUTION:The inside surface of a mold made of pure copper is plated with nickel, and is heated for 6-12hr at 300-450 deg.C, so that the diffusion layer of nickel- copper is formed between the lower part of the nickel plating layer and the copper base metal. Then, temp. inclination is made gentle by the nickel part, and cooling is improved. In addition, copper and nickel firmly bonds by way of the diffusion layer, thereby preventing the peeling of the plating layer. |
