| 摘要 |
PROBLEM TO BE SOLVED: To set repair easily when a semiconductor device is identified to be defective after inspection and to prevent the occurrence of a void in sealing resin, by filling the clearance between the semiconductor chip and a circuit board, with thermoplastic resin and hardening resin. SOLUTION: A clearance 11 of a semiconductor device 10 between a semiconductor chip 1 and a circuit board 2, is filled with thermoplastic resin 7 and hardening resin 5. In a face-down semiconductor device, the thermoplastic resin 7 is arranged in the center of the semiconductor chip 1 and the periphery is filled with hardening resin 5 at the time of the adhesion of the semiconductor chip 1 with the circuit board 2. Thus, the vicinity of the central part of the clearance 11 between the semiconductor chip 1 and the circuit board 2, is filled with thermal reversible resin 7 making the semiconductor chip 1 adhere to the circuit board 2 as a desirable form. Then, the periphery of the thermoplastic resin 7 is filled with hardening resin 5 making the semiconductor chip 1 adhere to the circuit board 2. |
