| 摘要 |
PURPOSE: A semiconductor acceleration sensor is provided to thin the thickness by controlling adhesive diffusion and adhesion thickness with the use of a first and a second stopper each formed on a first and a third semiconductor layers. CONSTITUTION: A semiconductor acceleration sensor comprises a first semiconductor layer(11) having a first stopper (11a); a second semiconductor layer(12) attached by an adhesive(14) adjacent to the first stopper(11a) formed on the first semiconductor layer(11); a third semiconductor layer(13) having a second stopper(13a) attached on a lower surface of the second semiconductor layer(12) by the adhesive(14), wherein silicon is used for the first, second, and third semiconductor layers(11, 12, 13) and thicknesses of the first and the second stoppers(11a, 13a) are controlled according to a thickness of the sensor. |
