发明名称 SEMICONDUCTOR DEVICE AND CAPILLARY FOR MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To stitch-bond a metallic wire to an inner lead, which has a surface material easy to oxidize, at fine pitches and stably with enough junction strength. CONSTITUTION:An inner lead 2, where an Ag layer is applied, and an Au metallic wire 1 are stitch-bonded by applying vibration energy and load through a capillary. For the junction part of the metallic wire 1, a plastic deformation part 11 consisting of the flat part and the concave on a intermetallic compound 4 of Au-Ag is made. The width F1 of this flat part is half or less than the diameter of the metallic wire 1 and nor less than 5mum, and the radius OR1 of curvature of the concave is twice or more than the metallic wire 1.
申请公布号 JPH05251494(A) 申请公布日期 1993.09.28
申请号 JP19920050492 申请日期 1992.03.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUMURA KIYOAKI
分类号 H01L21/60 主分类号 H01L21/60
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