| 摘要 |
PURPOSE:To automatically detect difference when all chips and all gold wire bonding parts are bonded and allow error judgement. CONSTITUTION:Image data 1 which has a point to be bonded with gold wire at the center of the screen is stored before or after the gold wire bonding and the coordinates whereupon the actual gold wire bonding is performed are extracted 10 from the image data. The device is provided with an error judging means 15 which extracts 12 the difference at the time of bonding from the detected coordinates 10 and the coordinates 1 whereupon bonding is to be performed and judges whether the difference is an error or not. |
