| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation and to prevent solder bridging when flow-soldering, by changing the shape of a heat radiation lead 502 of a resin-packaged semiconductor apparatus. SOLUTION: When the resin-packaged semiconductor apparatus comprising a plurality of leads and heat radiation leads added to them is conducted in flow-soldering process, solder-bridging is prevented at a lead terminal. The interval between the plurality of leads and heat radiation leads is set wide, with the shape of heat radiation leads varied long or short. COPYRIGHT: (C)2007,JPO&INPIT |
