Sensor package having stacked die

摘要

A small area semiconductor device package containing two or more MEMS sensor device die and a controller die for the sensor devices is provided. The controller die is mounted on top of the largest MEMS sensor device die (e.g., a gyroscope) and over a second MEMS sensor device die (e.g., an accelerometer). In one embodiment, the controller die is also mounted on the top of the second MEMS sensor device die. In another embodiment, the controller die overhangs the second MEMS sensor device die, which is of a lesser thickness than the first MEMS sensor device die.

主权项

1. A semiconductor device package comprising:
a first semiconductor device die; a second semiconductor device die; a controller die, wherein
a first major surface of the controller die is mechanically coupled to an active major surface of the first semiconductor device die,the first major surface of the controller die extends over an active major surface of the second semiconductor device die; a first set of wire bonds coupling a first set of contact pads of the controller die to contact pads of the first semiconductor device die; and a second set of wire bonds coupling a second set of contact pads of the controller die to contact pads of the second semiconductor device die.