| 摘要 |
PURPOSE:To improve high frequency characteristics of a resin-sealed semiconductor device. CONSTITUTION:A semiconductor device in which a semiconductor element 4, etc., placed on a die surface 3 of a lead frame 2 is sealed with molding resin 1 has a layer (hollow parts and liquid resin mixture) 6 containing fine hollow parts as parts of a sealing resin layer. High frequency characteristics of the device are improved by low permittivity of the layer 6 containing the hollow parts. Each hollow part has a diameter or a profile size of 0.1-1,000mum. |
