发明名称 MULTICHIP MODULE
摘要 <p>PURPOSE:To enable the function trimming of a passive element, and improve reliability and yield. CONSTITUTION:A heat generating element 4, a control circuit element 5 and a passive element 2 are mounted on a main surface of lead frame 1 integrated in a body with a heat sink, and are coated with mold resin 3. Since the part corresponding to the passive element 2 is not coated with the mold resin 3, the function trimming of the passive element 3 is enabled after coating. The part corresponding to the passive element 2 may be coated with, e.g. mold resin 3 after trimming.</p>
申请公布号 JPH05308118(A) 申请公布日期 1993.11.19
申请号 JP19920111593 申请日期 1992.04.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 DATE SHOJI;YASUDA YUKIHISA
分类号 H01L21/56;H01L25/00 主分类号 H01L21/56
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