| 摘要 |
PURPOSE:To prevent the contact with another electrode, etc. and remove dust, etc., thus enabling to securely perform wire connection by a method wherein the electrode of an element is connected to a lead frame part by means of wires in the state that the element is turned downward, after mounting the element on the bed part of the lead frame. CONSTITUTION:The lead frame 13 whereon an integrated circuit element 10 is mounted on the bed 12 is held by a carrying mechanism 14 with the mounting surface turned downward, and is then moved successively on a bonding stage part 14a as shown by an arrow mark A. The lead frame 13 has deposited foreign matters such as dust removed by shaking them off by the fine vibration at the tip 19 of a vibrator 18, before reaching the bonding stage part 14a. Next, the frame is carried onto the bonding stage part 14a and once stops. A bonding arm 15 provided under the bonding stage part 14a suitably selects a fixed electrode 17 of the element 10 and a lead part 11 of the lead frame 13, and then connects the element electrode 17 to the lead part 11 respectively. |
