发明名称 PREPARATION OF AROMATIC POLYAMIDE-IMIDE RESIN MOLDING
摘要 <p>PURPOSE:To obtain molding with excellent physical properties that can be molded stably without producing any cracking or peeling in a compression molding at a temperature lower than the melting temperature of the resin by heat-treating the resin in oxygen contained gas prior to the molding process. CONSTITUTION:Prior to a molding process, resin is heat-treated in oxygen contained gas under a condition satisfying the formula, where a1=2.5841, a2= -8.4926X10<-8>, a3=6,9984X10<-6>, a4=-2.0449X10<-8> are given, (t) and T indicate heat treatment time in the unit of hour, heat treatment temperature in the unit of deg.C and 200 deg.C<=T<=400 deg.C is given. Aromatic polyamide-imide resin is applied in the powdery or granular form, and material with an average particle diameter about 30mu max. is preferably used to obtain moldings excellent in mechanical properties. The oxygen contained gas prefers to contain oxygen of 10% min. When a heat treatment time (t) is shorter than the lower limit expressed by the right side of the formula, no cracking or peeling can be prevented and this method is not desired. When a heat treatment temperature does not reach 200 deg.C no good effect can be obtained by actual treatment time and when it is higher than 400 deg.C quick oxidative destruction will occur and this method also is not desirable.</p>
申请公布号 JPS59232811(A) 申请公布日期 1984.12.27
申请号 JP19830109028 申请日期 1983.06.16
申请人 SUMITOMO KAGAKU KOGYO KK 发明人 UENO SHIYOUJI;NAGAOKA KENJI;MIYASHITA AKIRA;HIRUKO SATOSHI
分类号 B29C33/00;B29B13/02;B29C43/00;B29C43/02;B29C43/32;B29C43/52;B29C43/58;B29K79/00;C08J3/00;C08J5/00;(IPC1-7):B29C3/00 主分类号 B29C33/00
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