发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for sensing easily the very fine wire resulting in a bonding inferiority. <P>SOLUTION: In the sensing of an inferior product of a bonding-oriented very fine wire obtained by a drawing work using a die, the inferior product is defined as the one wherein the difference between the maximum and minimum diameters of the section of the bonding-oriented very fine wire obtained after the drawing process which is vertical to its wire length exceeds the three percents of its wire diameter. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP3858805(B2) 申请公布日期 2006.12.20
申请号 JP20020312231 申请日期 2002.10.28
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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