| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that has a high-performance resistor for heating where thermal expansion in the electrically heated resistor can be inhibited for improving a heat resistance property in the resistor, or heat radiation from the resistor to an electrode can be inhibited for efficiently generating heat, and to provide a printer. SOLUTION: In this semiconductor device, the resistor 20 is formed on an insulating film 13 on a semiconductor substrate, and an insulating film 15 is formed on the resistor 20. The resistor 20 is made of a conductive film and is used for heating. This printer has a head section with an opening 19 for discharging ink 16, the resistor 20 for heating the ink 16, and the driving circuit Tr. In this case, film stress in the insulating film 15 on the resistor 20 should show compressibility stress, and at the same time should be larger than that of the insulting film 13 under the resistor 20. Or, an insulating film with thermal conductivity that is sufficiently smaller than the insulating film on the resistor should be formed while the current application region of the resistor is being surrounded.</p> |
