发明名称 CERAMIC MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve the problem associated with a conventional ceramic multilayer substrate which partially houses a functional material layer inside such that, (1) in manufacturing the ceramic multilayer substrate by a method wherein, after stacking and crimping a base material layer such as an insulator sheet and the functional material layer to form a laminate, the laminate is burned into the ceramic multilayer substrate, the periphery 2A of the functional material layer 2 swells as shown by a dashed line in Figure 10(b) at the time of crimping and hence the functional material layer cannot be formed into a desired pattern, and (2) the deformation of the substrate such as warping and waviness or delamination easily occurs due to a difference in a shrinkage percentage between the functional material layer 2 and the base material layer 1 at the time of burning. SOLUTION: The ceramic multilayer substrate 10 comprises the base material layer 11 formed by laminating a plurality of base material ceramic layers 11A, and a dielectric ceramic layer 12 which has a function different from that of the base material layer 11 and is interposed between the base material ceramic layers 11A. The end of the dielectric ceramic layer 12 located inside the base material layer 11 is formed with concave and convex portions 12A over the entire length thereof. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209820(A) 申请公布日期 2005.08.04
申请号 JP20040013665 申请日期 2004.01.21
申请人 MURATA MFG CO LTD 发明人 URAKAWA ATSUSHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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