| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of packing a conductor in the through-hole of the board by electrolytic plating with proper yield. SOLUTION: A through-hole 10x is formed at a board 10, and a metal foil 14 is arranged on one surface of the board 10; and the board 10 and the metal foil 14 are pressurized with an electric body 22 interposed, to press fit the board 10 and the metal foil 14 together. A conductor 16 is packed in the through-hole 10x by electrolytic plating which uses the metal foil 14 as a plating feeder electrode, and then the metal foil 14 is delaminated from the board 10. COPYRIGHT: (C)2007,JPO&INPIT
|
