| 摘要 |
PURPOSE:To obtain a bonding wire capable of reducing vibration breaking rate. CONSTITUTION:The bonding wire constituted of a gold alloy wire obtd. by incorporating high purity gold of >=99.999wt.% purity including, by weight, <0.0001% inevitable impurities with 0.0001 to 0.003% Ca, 0.0001 to 0.001% Be, 0.0001 to 0.004% Eu and 0.0001 to 0.005% Ti to regulate their total content to be added into 0.0013 to 0.01% is formed. |
