| 摘要 |
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support material such as an adhesive tape. A packaged semiconductor die that includes a first semiconductor die mounted to a support structure and encapsulated within a mold compound is mounted on the adhesive tape. A second semiconductor die is mounted to the packaged semiconductor die. Bond pads on the second semiconductor die are electrically connected to the leadframe, the support structure on which the first semiconductor die is mounted, or both. A mold compound is formed around the second semiconductor die, portions of the leadframe, and the packaged semiconductor die. The adhesive tape is removed and the leadframe is singulated to form multi-chip packages.
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