发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device equipped with an ESD protective circuit which prevents malfunction at the time of power on without using any special fabrication process. Ž<P>SOLUTION: The semiconductor integrated circuit device includes: a diode D1 which is connected forward from an output terminal 200 to the VDD power supply line; a diode D2 which is connected forward from the GND line to the output terminal 200; an NMOS transistor TN11 connected between the VDD power supply line and the GND line; and a PMOS transistor TP11 connected between the gate electrode of the NMOS transistor TN11 and the output terminal 200. The gate electrode of the PMOS transistor TP11 is connected with the VDD power supply line which makes the PMOS transistor TP11 nonconductive during normal operation. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010021214(A) 申请公布日期 2010.01.28
申请号 JP20080178454 申请日期 2008.07.08
申请人 TOSHIBA MICROELECTRONICS CORP;TOSHIBA CORP 发明人 OSHIMA SHINJI;UTSUNOMIYA TAKANORI
分类号 H01L21/8238;H01L21/822;H01L27/04;H01L27/06;H01L27/092 主分类号 H01L21/8238
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