INTEGRATED CIRCUIT COMPONENT SHIELDING

摘要

Embodiments of shielding apparatuses are disclosed herein. In some embodiments, a shielding apparatus may include first and second conductive regions and a plurality of vias disposed between the first and second conductive regions. The first and second conductive regions and the plurality of vias may surround an integrated circuit (IC) component and individual vias of the plurality of vias are spaced relative to one another to shield incoming or outgoing electromagnetic interference (EMI). Other embodiments may be described and/or claimed.

主权项

1. A method of shielding an integrated circuit (IC) component, comprising:
forming a conductive region; forming a plurality of vias; forming an IC component in a volume surrounded by the plurality of vias, wherein individual vias of the plurality of vias are spaced relative to one another to shield incoming or outgoing electromagnetic interference (EMI); and forming another conductive region such that the IC component and the plurality of vias are disposed between the conductive regions.