发明名称 |
Semiconductor Packages and Methods of Forming the Same |
摘要 |
A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection extending through a patterned layer, and the through vias may be offset from a surface of the patterned layer. The recess may be formed by selectively removing a seed layer used to form the through vias. |
申请公布号 |
US2016163564(A1) |
申请公布日期 |
2016.06.09 |
申请号 |
US201514696198 |
申请日期 |
2015.04.24 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Liu Chung-Shi;Lin Chih-Wei;Cheng Ming-Da |
分类号 |
H01L21/48;H01L23/538;H01L23/28;H01L23/00;H01L21/56 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
|
主权项 |
|
地址 |
Hsin-Chu TW |